Model Name | M.2 (P30) 3TE7 |
Interface | PCIe Gen. III x2 |
Flash Type | 3D TLC |
Capacity | 32GB~512GB |
Sequential R/W (MB/sec, max.) | 1650/1350 |
Max. Power Consumption | 1.6W(3.3V, 470mA) |
Max. Channels | 4 |
Thermal Sensor | Y |
Dimension (WxLxH/mm) | 22.0 x 30.0 x 2.66 (*See detailed in mechanical drawings) |
Vibration | 20G@7~2000Hz |
Shock | 1500G@0.5ms |
MTBF | >3 million hours |
Storage Temperature | -40°C ~ +85°C |
Operation Temp. | 32GB | 64GB | 128GB | 256GB | 512GB |
Standard Grade (0°C ~ +70°C) | DEM23-32GIG1ECASH | DEM23-64GIG1ECADH | DEM23-A28IG1ECAQH | DEM23-B56IG1ECAQH | DEM23-C12IG1ECAQH |
Industrial Grade (-40°C ~ +85°C) | DEM23-32GIG1ECASH | DEM23-64GIG1EWADH | DEM23-A28IG1EWAQH | DEM23-B56IG1EWAQH | DEM23-C12IG1EWAQH |
#innodiskssdm2 #ssdcongnghiep #m2ssd3te7 #innodiskssdm2p303te7 #M.2(P30)3TE7
Applications | |
Server Application | |
Featured Technologies: | |
ETEP | |
Thermal Sensor |
Từ khóa: M 2 P30 3TE7